The shortage for ICT personal in the EU is large and expected to increase. The aim of this research is to contribute to a better understanding of the roles and competences needed, so that education curricula can be better aligned to evolving market demand by answering the research question: Which competence gaps do we need to bridge in order to meet the future need for sufficiently qualified personnel in the EU Software sector? In this research, a mixed method approach was executed in twelve European countries, to map the current and future needs for competences in the EU. The analyses shows changes in demand regarding technical skills, e.g. low-code and a stronger focus on soft skills like communication and critical thinking. Besides this, the research showed educational institutes would do well to develop their curricula in a practical way by integration of real live cases and work together with organizations.
MULTIFILE
Many quality aspects of software systems are addressed in the existing literature on software architecture patterns. But the aspect of system administration seems to be a bit overlooked, even though it is an important aspect too. In this work we present three software architecture patterns that, when applied by software architects, support the work of system administrators: PROVIDE AN ADMINISTRATION API, SINGLE FILE LOCATION, and CENTRALIZED SYSTEM LOGGING. PROVIDE AN ADMINISTRATION API should solve problems encountered when trying to automate administration tasks. The SINGLE FILE LOCATION pattern should help system administrators to find the files of an application in one (hierarchical) place. CENTRALIZED SYSTEM LOGGING is useful to prevent coming up with several logging formats and locations. Abstract provided by the authors. Published in PLoP '13: Proceedings of the 20th Conference on Pattern Languages of Programs ACM.
From ACM: "In cases where architectural documentation is outdated or missing, software architecture reconstruction (SAR) techniques may be used to create architectural views of a system. This paper describes a case study in which SAR techniques are applied to reconstruct module views of a case system; a debt settlements suite for local governments, developed in C#. A manual approach and its results are described and compared to the outcome of a layers reconstruction algorithm. Furthermore, this paper explains how software architecture compliance checking (SACC) techniques may help to test the results of reconstruction activities. In this study, SAR and SACC were supported by HUSACCT, a tool that provides rich sets of module and rule types in support of layers, facade, and gateway patterns." https://doi.org/10.1145/3129790.3129809
Betonprinten biedt veel nieuwe mogelijkheden op het gebied van productie en materiaal, maar vraagt van het MKB en startups flinke investeringen in kennis en middelen om er mee aan de slag te gaan. Met name slicer software, dat 3D modellen omzet naar printercode, vormt een bottleneck omdat deze alleen commercieel en printer-specifiek verkrijgbaar zijn. Saxion, Vertico en White Lioness willen in dit project de haalbaarheid van gratis open source slicer software die als cloud dienst wordt aangeboden onderzoeken. Deze oplossing maakt betonprinten bereikbaar voor meer innovatieve toepassingen vanuit MKB en startups, en vormt een platform voor het verzamelen en delen van kennis op het gebied van betonprinten.
Heb je wel eens gemerkt dat de premie voor je autoverzekering verandert als je in een andere wijk gaat wonen? Verzekeraars berekenen dit met een algoritme, wat kan leiden tot indirecte discriminatie. Dit project onderzoekt hoe zulke digitale differentiatie (DD) zowel eerlijk als rendabel kan.
Many lithographically created optical components, such as photonic crystals, require the creation of periodically repeated structures [1]. The optical properties depend critically on the consistency of the shape and periodicity of the repeated structure. At the same time, the structure and its period may be similar to, or substantially below that of the optical diffraction limit, making inspection with optical microscopy difficult. Inspection tools must be able to scan an entire wafer (300 mm diameter), and identify wafers that fail to meet specifications rapidly. However, high resolution, and high throughput are often difficult to achieve simultaneously, and a compromise must be made. TeraNova is developing an optical inspection tool that can rapidly image features on wafers. Their product relies on (a) knowledge of what the features should be, and (b) a detailed and accurate model of light diffraction from the wafer surface. This combination allows deviations from features to be identified by modifying the model of the surface features until the calculated diffraction pattern matches the observed pattern. This form of microscopy—known as Fourier microscopy—has the potential to be very rapid and highly accurate. However, the solver, which calculates the wafer features from the diffraction pattern, must be very rapid and precise. To achieve this, a hardware solver will be implemented. The hardware solver must be combined with mechatronic tracking of the absolute wafer position, requiring the automatic identification of fiduciary markers. Finally, the problem of computer obsolescence in instrumentation (resulting in security weaknesses) will also be addressed by combining the digital hardware and software into a system-on-a-chip (SoC) to provide a powerful, yet secure operating environment for the microscope software.
