Inkjet printing is a rapidly growing technology for depositing functional materials in the production of organic electronics. Challenges lie among others in the printing of high resolution patterns with high aspect ratio of functional materials to obtain the needed functionality like e.g. conductivity. μPlasma printing is a technology which combines atmospheric plasma treatment with the versatility of digital on demand printing technology to selectively change the wetting behaviour of materials. In earlier research it was shown that with μPlasma printing it is possible to selectively improve the wetting behaviour of functional inks on polymer substrates using atmospheric air plasma. In this investigation we show it is possible to selectively change the substrate wetting behaviour using combinations of different plasmas and patterned printing. For air and nitrogen plasmas, increased wetting of printed materials could be achieved on both polycarbonate and glass substrates. A minimal track width of 320 μm for a 200 μm wide plasma needle was achieved. A combination of N2 with HMDSO plasma increases the contact angle for water up from <100 to 1050 and from 320 to 460 for DEGDMA making the substrate more hydrophobic. Furthermore using N2-plasma in combination with a N2/HMDSO plasma, hydrophobic tracks could be printed with similar minimal track width. Combining both N2 -plasma and N2/HMDSO plasma treatments show promising results to further decrease the track width to even smaller values.